100-100000926WOF specification sheet

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Product specification information

Specifications for 100-100000926WOF

AMD Ryzen 7 Octa (8) Core Socket AM4 5700X 3.4GHz boost up to 4.6GHz 32MB L3 Cache Processor

100-100000926WOF Gallery image 1 [Size: 943 (W) x 943 (H)]  
AMD Ryzen 7 Octa (8) Core Socket AM4 5700X 3.4GHz boost up to 4.6GHz 32MB L3 Cache Processor, 65W Default TDP, TSMC 7nm FinFET, No graphics, no heatsink and fan

AMD Ryzen 7 Socket AM4 Processor

AMD

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Specifications:

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Specificationsspacer
Product Code100-100000926WOFspacer
General Specifications
PlatformDesktop
Product FamilyAMD Ryzen Processors
Product LineAMD Ryzen 7 Desktop Processors
# of CPU Cores8
# of Threads16
Max. Boost ClockUp to 4.6GHz
Base Clock3.4GHz
L1 Cache512KB
L2 Cache4MB
L3 Cache32MB
Default TDP65W
Processor Technology for CPU CoresTSMC 7nm FinFET
Unlocked for OverclockingYes
CPU SocketAM4
Socket Count1P
Thermal Solution (PIB)Not included
Max. Operating Temperature (Tjmax)90°C
Launch Date4/4/2022
*OS SupportWindows 11 - 64-Bit Edition
Windows 10 - 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
Connectivity
PCI Express VersionPCIe 4.0
System Memory TypeDDR4
Memory Channels2
System Memory SpecificationUp to 3200MHz
Max Memory Speed2x1R
DDR4-3200
2x2R
DDR4-3200
4x1R
DDR4-2933
4x2R
DDR4-2667
Product IDs
Product ID Boxed100-100000926WOF
Product ID Tray100-000000926
Key Features
Supported TechnologiesAMD StoreMI Technology
AMD "Zen 3" Core Architecture
AMD Ryzen VR-Ready Premium
Detailed Specifications
PlatformDesktop
Market SegmentEnthusiast Desktop
Product FamilyAMD Ryzen Processors
Product LineAMD Ryzen 7 Desktop Processors
Consumer UseYes
Regional AvailabilityGlobal, China, NA, EMEA, APJ, LATAM
Former Codename"Vermeer"
Architecture"Zen 3"
# of CPU Cores8
Multithreading (SMT)Yes
# of Threads16
Max. Boost ClockUp to 4.6GHz
Base Clock3.4GHz
L1 Cache512KB
L2 Cache4MB
L3 Cache32MB
Default TDP65W
Processor Technology for CPU CoresTSMC 7nm FinFET
Processor Technology for I/O Die12nm (Globalfoundries)
CPU Compute Die (CCD) Size74mm²
I/O Die (IOD) Size125mm²
Package Die Count2
Unlocked for OverclockingYes
CPU SocketAM4
Socket Count1P
Supporting ChipsetsX570
X470
X370
B550
B450
B350
A520
CPU Boost TechnologyPrecision Boost 2
Instruction Setx86-64
Supported ExtensionsAES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
Thermal Solution (PIB)Not included
Max. Operating Temperature (Tjmax)90°C
Launch Date4/4/2022
*OS SupportWindows 11 - 64-Bit Edition
Windows 10 - 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
USB Type-C SupportYes
Native USB 3.2 Gen 2 (10Gbps) Ports4
Native USB 3.2 Gen 1 (5Gbps) Ports0
Native USB 2.0 (480Mbps) Ports0
Native SATA Ports2
PCI Express VersionPCIe 4.0
Native PCIe Lanes (Total/Usable)24/20
Additional Usable PCIe Lanes from MotherboardAMD X570
16x Gen 4
AMD X470
2x Gen 3
AMD X470
8x Gen 2
NVMe SupportBoot, RAID0, RAID1, RAID10
System Memory TypeDDR4
Memory Channels2
Max. Memory128GB
System Memory SubtypeUDIMM
System Memory SpecificationUp to 3200MHz
Max Memory Speed2x1R
DDR4-3200
2x2R
DDR4-3200
4x1R
DDR4-2933
4x2R
DDR4-2667
ECC SupportYes (Requires mobo support)
Integrated GraphicsNo
Graphics ModelDiscrete Graphics Card Required
Product IDs
Product ID Boxed100-100000926WOF
Product ID Tray100-000000926
Supported TechnologiesAMD StoreMI Technology
AMD "Zen 3" Core Architecture
AMD Ryzen VR-Ready Premium