Features:
X3D Turbo Mode
X3D Turbo Mode's unique optimization parameters allow even Ryzen™ 9000 X3D gaming Performance enhance & Ryzen™ 9000 non-X3D processors to achieve similar gaming performance levels as their Ryzen™ X3D counterparts. Experience smoother gameplay, higher frame rates, and reduced latency with GIGABYTE's BIOS innovation- X3D Turbo Mode.
AORUS AI SNATCH
Unleash Ultimate Performance with One-Click Activation.
Auto CPU & DDR5 Memory Boost
With just a single click, unleash the full potential of CPU & DDR5 memory, instantly boosting your gaming and work efficiency.
One-Click Acceleration:
Enhance CPU & DDR5 speeds with a single click.
Fast AI Performance
Accelerate AI processing for greater performance
Up to 8% AI Performance*
Boost CPU & Memory Performance
Raise system speed and performance.
Up to 9% CPU & Memory Performance Boost
Maximize performance in a snap
Enable users to easily become overclocking experts through a simple interface.
Smart & Safe overclocking
Protect your motherboard through multiple over-temperature and over-current safeguards.
Less Power Usage Optimal power-efficiency, Enhance Up to 9% CP/Per Watt*
With faster computations, it also means reduced power consumption, making it more environmentally friendly and energy-efficient, continuously contributing to the well-being of our planet.
AI-Driven PCB Technology-Redefining PCB Design with Artificial Intelligence
AI-Driven PCB Technology employs AI algorithms to optimize vias, routing and stackups. It ensures peak performance and signal integrity across single and cross-layer throughout the design process.
AI-ViaFusion Technology
Optimized vias & pads for signal integrity
AI-Trace Technology
Smart routing for peak performance
AI-Layer Technology
Tailored stackups for enhanced functionality
Key Features:
AI-ViaFusion™ Technology - AI-Powered Excellence in Signal Integrity
Reduction in Signal Reflection Up to 28.2%. AI-ViaFusion, an AI-assisted via optimization technology, determines optimal via and pad sizes across PCB areas. This technology enhances cross-layer signal integrity and transmission efficiency, outperforming traditional design methods.
Best-in-class Signal Quality
AI-ViaFusion Technology - AI-Engineered Via Design Formula
AI-ViaFusion is a proprietary AI-generated hybrid via structure design. This PCB technology, validated through AI simulations and testing, aims to enhance high-speed signal transmission.
Optimized Via Design
Varied via sizes for optimized signal and power paths
Driven Pad Optimization
Custom pad sizes for performance and production balance
Precision Impedance Matching
Via & pad sizes selected for optimal signal impedance
Minimized Insertion Loss
Optimized vias reduce signal loss
Enhanced Return Loss
Precision impedance matching reduces reflections
Optimized Eye Diagram
Wider eye opening improves signal integrity
AI-ViaFusion Technology - AI-Driven Revolution in PCB Design
Vias (Vertical Interconnect Access) are critical for multi-layer PCB connectivity. Via size significantly impacts signal integrity, affecting capacitance, reflections, and crosstalk.
Strategic Via Sizing
Optimized for varied signals across PCB
Enhanced Impedance Matching
Precise control via machine learning
Space Optimization
Maximized layout efficiency with signal integrity
AI-Trace Technology-Revolutionizing PCB Routing with AI
AI-Trace Technology transforms PCB design by leveraging AI to optimize trace routing, resulting in enhanced performance and signal integrity.
Fiber Weave Effect Mitigation
Optimized signal synchronization
Shielded Memory Routing
Optimized signal shielding and precision
Impedance-Optimized Topology
Refined traces with minimal resistance
Isolated Memory Routing
Optimized trace layout and layer separation
Daisy-Chained Routing
Innovative design eliminates signal bottlenecks
Mitigating Fiber Weave Effect with AI-Trace Technology
Fiber Weave Effect in high-speed PCBs stems from varying dielectric constants of epoxy resin and glass fibers, this causes varying signal propagation speeds, leading to signal integrity issues such as crosstalk and jitter. AI-Trace Technology implements innovative routing angles to mitigate this effect.
Benefits of Mitigation:
AI-Layer Technology -Next-Generation Multi-Layer PCB Design
AI-Layer Technology creates innovative layer materials for multi-layer PCBs, delivering unparalleled performance.
Core Innovation:
Key Features:
HyperTune BIOS - AI-Driven Advanced BIOS Optimization Technology
BIOS Efficiency Boost Up to 95%+. HyperTune BIOS uses AI to optimize signals. The 800 series implements this for peak efficiency, enabling significant memory clock speed boosts and enhanced overall performance.
AI-Enhanced Performance Optimization
Infinite Memory Performance
EAGLE motherboards boost DDR5 memory performance and offer top-notch compatibility using various advanced methods.
Steady Power
Eagle Series with steady power keeps your AI operation smooth.
Digital Twin VRM Design
Delivers consistent, high-powered performance to elevate your overclocking to the next level.
5 VCORE Phases DrMOS 60A
Unlock the full power of your multi-core CPU for unmatched performance.
2 SOC Phase DrMOS 60A
Optimized for integrated GPU performance and memory management within the CPU.
2 MISC Phases Ppak
Deliver reliable power to your CPU-connected PCIe lanes for uninterrupted performance.
Comprehensive Thermal
Advanced full-metal thermal design and durable heatsinks to keep your system cool and efficient.
"Stay Cool, Game On"
High-coverage MOSFETs with integrated molded heatsinks
4X larger surface area for enhanced heat dissipation
With up to 4 times the surface area of traditional coolers, this advanced design significantly boosts MOSFET cooling performance.
Multi-cut design with channels for improved airflow
5 W/mK thermal pad for efficient thermal conductivity
True one-piece heatsink design
Smart Fan 6
Superior cooling performance and whisper-quiet operation for your gaming rig.
High Current Support
Precision Control
Dual Curve Mode
Fan Stop Technology
Enhance Fan Curve UI
Slope/Stair Dual Graph Mode
Manual Input
EZ Tuning
Fan Curve Profile
Hassle-free Assembly
Our cutting-edge motherboard is designed for the ultimate DIY experience. Creating your own PC becomes a delightful and smooth process.
EZ-Latch Designs
User-friendly designs simplifying the assembly process.
Fast-Access Controls
Handy, Revert, Refresh
EZ Debug Zone
Centralized debug LEDs and control buttons provide a handy and organized troubleshooting process when building a new computer.
Optimal DRAM Installation Indicator
The DRAM Indicator LED will turn on when a module is installed into a non-recommended slot.
Q-FLASH Auto Scan
The new Auto Scan function featues when using USB flashdrive during Q-Flash, the BIOS file will be auto scanned instead of searching manually.
Q-FLASH PLUS
Effortlessly upgrade your BIOS without the need to install CPU, RAM, or GPU.
All-round Connectivity
Experience ultimate connectivity with next-generation network, storage, and Wi-Fi solutions, delivering lightning-fast data transfer speeds.
2.5GbE LAN
Supercharge your gaming with 2.5GbE LAN Achieve lightning-fast speeds, minimal lag, and unbeatable performance to elevate your gaming setup and dominate the competition.
802.11ax Wi-Fi 6
The Wireless solution 802.11ax Wi-Fi 6 enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps and 5Gbps. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
High-End Audio Capacitors
These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects.
Audio Noise Guard
Essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
Born from Ultra Durable™
Technology embodies our commitment to excellence, providing gamers with a platform that's not only powerful but also built for longevity and reliability. GAMING series motherboards are engineered to endure and excel.
UD Power Connector
Our innovative UD Power Connector design enhances power conductivity and thermal dissipation.
Solid Pins
Delivers superior conductivity and signal transmission and reduces metal wear from repeated connections.
Collaborative Excellence in Computing
GIGABYTE motherboards showcases our devotion to BIOS improvement. Through synergy with our user community, we democratize next-level computing power.
UC BIOS
Restructured with user-centered and intuitive performance adjustment mechanisms.
Multi-Theme
Multiple BIOS skin with newly exclusive grayscale mode
AIO Fan Control
Adjust AIO fan speed in the BIOS
Multi-Theme
Now users can choose different BIOS themes with one simple click It not only delivers an immersive user experience but also offers a brand new user-friendly theme: Grayscale.
AIO Fan Control
Enable non-windows users to adjust AIO fan speed in the BIOS before entering the OS.
Refined BIOS Interface
GIGABYTE User-Centred (UC) BIOS elevates the interface, delivering an optimized experience through an easy-to-navigate layout and attractive design for optimal usability.
Quick Access Function
GIGABYTE UC BIOS' Quick Access function selects brings 9 key options from Advanced Mode directly into Easy Mode, enabling swift adjustments without extensive navigation.
GIGABYTE Control Center
A unified software platform encompassing multiple GIGABYTE product.
RGB Fusion
Personalize the RGB illumination on your motherboard and connected peripherals.
Spotlight your flair
Liberate your imagination using GCC's versatile illumination options for your motherboard. Tailor your setup with eye-catching displays that mirror your unique personality and preferences.
Varnish your shine
Programmable RGB LED connectors enable precise control over individual LEDs (for ARGB GEN2 devices), seamlessly managed through the GCC.
AORUS & HWiNFO Co-branded OSD
AORUS and HWiNFO co-branded OSD(On-Screen Display) can display values as text or graphs in an overlay or independent window, also in full-screen applications and games, with no need for additional software installation.
Default AORUS skin
When using HWiNFO on a GIGABYTE motherboard, a custom AORUS-themed interface automatically activates, offering light and dark options. This AORUS Skin can be manually applied to non-GIGABYTE boards as well.
Memory Timings Monitor
Thanks to the collaborative efforts of GIGABYTE and HWiNFO experts, this sophisticated monitoring tool now provides unprecedented detail in memory timing readouts. This empowers users to closely track memory performance and gather crucial insights.
Detailed BIOS information
GIGABYTE motherboard users can now access comprehensive BIOS details in real-time through HWiNFO. This includes toggle and tweaker statuses, as well as BIOS versions. No need for system reboots to check BIOS info. anymore.
Specifications:
| ©2026 Respective owners and brand holders. This table has been carefully researched and generated by ComXpert International CC (//www.comx-computers.co.za), however, errors and omissions may occur. Only references to South Africa apply. All products are sourced in South Africa from the official suppliers and the warranty is that of the local supplier. E&OE. This table and our site's content may be used on condition that this notice and link remains intact and unaltered. | |
Specifications![]() | |
| Product Code | MB-GB840ME+W![]() |
| CPU | AMD Socket AM5, support for: |
| AMD Ryzen 9000 Series Processors/ | |
| AMD Ryzen 8000 Series Processors/ | |
| AMD Ryzen 7000 Series Processors | |
| Chipset | AMD B840 |
| Memory | Support for DDR5 7600(O.C.) / 7200(O.C.) / 7000(O.C.) / 6800(O.C.) / 6600(O.C.) / 6400(O.C) / 6200(O.C) / 6000(O.C) / 5800(O.C) / 5600(O.C) / 5200 / 4800 / 4400 MT/s memory modules. |
| 2 x DDR5 DIMM sockets supporting up to 128 GB (64 GB single DIMM capacity) of system memory | |
| Dual channel memory architecture | |
| Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules | |
| Support forAMD EXtended Profiles for Overclocking (AMD EXPO ) and Extreme Memory Profile (XMP) memory modules (The CPU andmemory configurationmay affect the supportedmemory types, data rate (speed), and number of DRAM modules.) | |
| Onboard Graphics | Integrated Graphics Processor with AMD Radeon Graphics support: |
| - 1 x DisplayPort, supporting a maximum resolution of 3840x2160@144 Hz | |
| * Support for DisplayPort 1.4 version and HDR. | |
| - 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz | |
| * Support for HDMI 2.1 version, HDCP 2.3, and HDR. | |
| ** Support for native HDMI 2.1 TMDS compatible ports. | |
| (Graphics specifications may vary depending on CPU support.) | |
| Audio | Realtek Audio CODEC |
| High Definition Audio | |
| 2/4/5.1/7.1-channel | |
| * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. | |
| LAN | Realtek 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) |
| Wireless Communication module | Realtek Wi-Fi 6 RTL8851BE |
| - WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz carrier frequency bands | |
| - BLUETOOTH 5.3 | |
| - Support for 11ax 80MHz wireless standard | |
| (Actual data rate may vary depending on environment and equipment.) | |
| Expansion Slots | 1 x PCI Express x16 slot (PCIEX16), integrated in the CPU: |
| AMD Ryzen 9000/7000 Series Processors support PCIe 4.0 x16 mode | |
| AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode | |
| AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode | |
| * The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot. | |
| Chipset: | |
| - 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4) | |
| Storage Interface | 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2580/2280 SSDs: |
| AMD Ryzen 9000/7000 Series Processors support PCIe 4.0 x4/x2 SSDs | |
| AMD Ryzen 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs | |
| AMD Ryzen 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs | |
| 1 x M.2 connector (M2C_SB), integrated in the Chipset, supporting Socket 3, M key, type 2280 PCIe 3.0 x2 SSDs | |
| 4 x SATA 6Gb/s connectors | |
| RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices | |
| * RAID 5 is only available on AMD Ryzen 9000 Series Processors. | |
| RAID 0, RAID 1, and RAID 10 support for SATA storage devices | |
| USB | CPU: |
| - 2 x USB 3.2 Gen 1 ports on the back panel | |
| CPU+USB 2.0 Hub: | |
| - 4 x USB 2.0/1.1 ports on the back panel | |
| Chipset: | |
| - 1 x USB Type-C port with USB 3.2 Gen 1 support, available through the internal USB header | |
| - 2 x USB 3.2 Gen 1 ports available through the internal USB headers | |
| - 4 x USB 2.0/1.1 ports available through the internal USB headers | |
| Internal I/O Connectors | 1x 24-pin ATX main power connector |
| 1 x 8-pin ATX 12V power connector | |
| 1 x CPU fan header | |
| 1 x CPU fan/water cooling pump header | |
| 1 x system fan header | |
| 1 x system fan/water cooling pump header | |
| 2 x addressable RGB Gen2 LED strip headers | |
| 1 x RGB LED strip header | |
| 2 x M.2 Socket 3 connectors | |
| 4 x SATA 6Gb/s connectors | |
| 1 x front panel header | |
| 1 x front panel audio header | |
| 1 x USB Type-C header, with USB 3.2 Gen 1 support | |
| 1 x USB 3.2 Gen 1 header | |
| 2 x USB 2.0/1.1 headers | |
| 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0/GC-TPM2.0 SPI V2 module only) | |
| 1 x reset jumper | |
| 1 x Clear CMOS jumper | |
| Back Panel Connectors | 1 x PS/2 keyboard/mouse port |
| 4 x USB 2.0/1.1 ports | |
| 1 x DisplayPort (Note) | |
| 1 x HDMI port (Note) | |
| 1 x Q-Flash Plus button | |
| 2 x USB 3.2 Gen 1 ports | |
| 1 x RJ-45 port | |
| 2 x SMA antenna connectors (2T2R) | |
| 3 x audio jacks | |
| (Note) Actual support may vary by CPU. | |
| I/O Controller | iTE I/O Controller Chip |
| H/W Monitoring | Voltage detection |
| Temperature detection | |
| Fan speed detection | |
| Water cooling flow rate detection | |
| Fan fail warning | |
| Fan speed control | |
| * Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install. | |
| BIOS | 1 x 256 Mbit flash |
| Use of licensed AMI UEFI BIOS | |
| PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 | |
| Unique Features | Support for GIGABYTE Control Center (GCC) |
| * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. | |
| Support for Q-Flash | |
| Support for Q-Flash Plus | |
| Support for Smart Backup | |
| Bundled Software | Norton Internet Security (OEM version) |
| LAN bandwidth management software | |
| Operating System | Support for Windows 11 64-bit |
| Support for Windows 10 64-bit | |
| Form Factor | Micro ATX Form Factor; 24.4cm x 24.4cm |
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